RC-841

等离子机

Plasma machine

 

设备介绍

专为微电子表面清洁与处理设计可以用于处理各种电子材料，包括塑料、金属或者玻璃等。

Function

Designed for surface cleaning and processing of Microelectronics It can be used to handle various electronic materials, including plastic, metal or glass.

用途

• 前焊盘的表面清洗
• 集成电路键合前的等离子清洗
• ABS 塑料的活化和清洗
• 陶瓷封装电镀前的清洗
• 金属工件，培养皿、酶标板、陶瓷、玻璃等材料表面改性和清洗

Purpose

• Surface cleaning of front pad before wire bonding
• Plasma cleaning before integrated circuit bonding
• Activation and cleaning of ABS plastics
• Cleaning before ceramic package plating
• Surface modification and cleaning of metal work piece, culture dish, enzyme plate, ceramic, glass and other

参数及适用范围 Parameters and scope of application

电压 Power supply	380V AC / 50HZ
功率 Power	3KW
重量 Weight	约350KG
腔体容积 / Cavity volume	40L (350mm * 300mm * 400mm)
单层最大处理面积 / Single layer maximum processing area	310（w）*300（d）mm